How to Eliminate Heat in Electronics

Most of us have lost an electronic device due to over-heating; something in the circuit burns out and the device no longer works as well, if at all.
There is something called Ohm’s Law which relates to the heat produced from the flow of electrons in a copper (or any metal) wire. Another related term is impedance and/or resistance. Early fuses were just thin diameter copper wires that melted when too much current (amps) were passed through. Thankfully, we now have circuit breakers.
Please read the Nine Fields page for more background.
To eliminate resistance/impedance/heat from our electrical wires, we must change the paradigm. Instead of putting all of that electrical power into the wire, we will put it around the outside of the wire or solder or connectors. Yes, we will still be putting a few microwatts into the wire; that creates/establishes the counter-rotating fields that we will be using.
Just to make sure that you are following, I am talking about every wire in our homes, offices, factories, cars, trucks, ships, planes; everything. I am also talking about the embedded millions of Integrated Circuits (ICs) in the layers of solder in every chip. Yes, all of the connectors to all of our devices from the mother and daughter boards. All of these run electricity within the metal to make the connections carrying data. When we run power within a wire/solder, we make heat. That is why we must have cooling fans or heat sinks; got to get rid of the heat or the device will melt like the old fashioned fuse.
When we talk about carrying data, we are also talking about establishing/creating a carrier wave; all data is modulated onto a carrier wave.
Ok. The trick is to create the 9 fields around the wire/solder and, then, create the carrier wave(s), and, then, modulate the data on the/those carrier waves. This can be done.
Now, we are transmitting data over a powered carrier wave the entire length of the wire. We are doing this with a very small amount of power in the wire. This in-the-wire power is carried along the wire by the external carrier wave; again, along the entire length of the wire. As there is no resistance/impedance along the outside of the wire, there is no distance limitation for Direct Current electricity (normally 600 feet or so).
This external carrier wave can be used for both modulated data and power; both Alternating and Direct Current (AC/DC). Our centralized power distribution GRID can use this technology to save many Megawatts that are lost in heat/resistance/impedance. This especially true during high load or peak usage times when the wire get so hot that they expand and, sometime, short out when they touch a Ground or the ground.
I haven’t talked about throughput or bandwidth. We use the first field for propagation of the carrier wave along the wire and the second for data modulation. When we limited ourselves to the diameter of the wire, we limited ourselves in the amount of data that could be transmitted; this is directly related to the heat/resistance/impedance produced. When we move to the outside of the wire, the bandwidth limitations tend to vanish (along with the heat) and that is just using two of the fields. There are more fields that we can use.
This is just a paradigm change that we haven’t seen yet. It has been staring us in the face, but we were not ready to see it. That is changing.